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3D-Micromac receives order for multiple laser lift-off systems for microLED device manufacturing

3D-Micromac AG (Chemnitz, Germany), an industry leader in laser micromachining and roll-to-roll laser systems for the semiconductor, photovoltaic, glass and display markets, announced that a leading optical solutions provider has purchased multiple microMIRA Laser Lift-Off (LLO) systems for use in the production of microLED devices. The customer will install the new microMIRA systems in pilot- and production lines at its state-of-the-art LED chip factory in Asia.

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Pixelligent secures $38M to accelerate commercialisation

Pixelligent Technologies LLC (Baltimore, Maryland) has secured $38 million in non-dilutive growth capital backed by its intellectual property portfolio. The capital was provided by a funding vehicle managed by MVolution Partners LLC and facilitated by insurance and valuation services provided by Aon. This additional growth capital brings the company’s total funding in this round to over $45 million, including equity capital from its strategic and financial shareholders.

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LOPEC 2023: International industry platform to experience flexible and printed electronics

From 28 February to 2 March 2023, LOPEC will once again bring the international printed electronics industry together in Munich. For three days at the Messe München ICM, the leading trade fair and the most important conference for flexible, organic and printed electronics will look at the latest industry trends and present innovations for one of the key technologies of the 21st century.

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