The strategic partnership aims to develop and optimise alternative bonding and debonding technologies for advanced CMOS and heterogeneous integration applications, including quantum computing.
The Fraunhofer Institute for Electron Beam and Plasma Technology FEP from Dresden (Germany) has developed an innovative PECVD process that enables the deposition of graphene at high process speeds and offers higher production throughputs and a wider range of substrates at lower process temperatures.
