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ZEBRA super-aligned semiconducting carbon nanotubes on wafer (photo: Carbonics)

Carbonics introduces first ZEBRA carbon-on-silicon solution for RF components

Carbonics, Inc., based in Los Angeles, California, recently launched its ZEBRA carbon-on-silicon technology for radio frequency components and devices in the rapidly expanding wireless, communications, defence, and aerospace markets. Carbonics is a venture-backed start-up that is focused on developing and commercialising a carbon-on-wafer single chip solution that is reported to vastly improve the power consumption and performance of wireless products – including next-generation smartphones and communication devices.

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The next generation of the uTrust Sense Temperature Tracker from Identiv, Enfucell, NXP Semiconductors, and Syntel (photo: Identiv)

Identiv announces next generation of its smart temperature sensor solution for IoT

Identiv, Inc., a physical security and secure identification provider based in Fremont, California, announced the launch of the next generation of its uTrust Sense Temperature Tracker, a low-cost, portable, powered smart sensor that tracks and stores temperature readings. In addition to its low cost and small form factor, it can be read by any near field communication (NFC) reader, such as a mobile phone, and uploaded to the Internet for analytic purposes.

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Automotive tail lights with OLED technology have been a highlight of LOPEC 2016 (photo: Messe München)

LOPEC 2017: Printed electronics for the car of tomorrow

The tradeshow LOPEC will take place at the trade fair centre in Munich, Germany, from  28-30 March 2017, providing information on the latest products, technologies and trends in printed electronics. This year, the automotive industry will be one of the focal points of the international exhibition and conference. Whether in the form of curved displays in the dashboard or OLEDs in vehicle lighting, printed electronic components are opening up a wealth of new design options and are increasing driving comfort levels.

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