Printed electronics in 3D, also known as 3D structural electronics, equip all kinds of objects with additional electronic functions. LOPEC, the international exhibition and conference for the printed electronics industry taking place in Munich, Germany, from 24 to 26 March 2020, will provide information about production processes, applications and the potential of the technology.
Fraunhofer researchers intend to develop a methodology that combines biotechnology processes with low-energy electron-beam technology (photo: Fraunhofer FEP)
The Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP (Dresden, Germany) has been utilising electron-beam technology for decades in the development of cleaning, sterilisation, and surface-modification processes and systems. Fraunhofer researchers from the Medical and Biotechnological Applications division (MBA) now intend to develop a methodology that combines biotechnology processes with low-energy electron-beam technology. Moreover, this hybrid methodology will be combined with existing FEP expertise in the area of sensor technology. The anticipated research programme will be presented at the MedtecLIVE trade show in Nuremberg, Hall 10, Booth No. 10.0.513, taking place from 31 March – 2 April 2020.
TactoTek (Oulu, Finland) and Marquardt are developing an injection-moulded structural electronics (IMSE) solution for a leading automotive OEM in their first collaboration project. The pre-development project is for a specific vehicle family and includes full automotive validation of the IMSE parts.
