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The fabric substrate SEFAR TCS Planar

CSEM and Sefar develop low-cost technology for large-area OLEDs

Developing a low-cost, efficient method of increasing the attractiveness of OLEDs for lighting poses a significant challenge. Thanks to a CTI project, the micro- and nanotechnology R&D centre CSEM and Sefar AG (both from Switzerland) have succeeded in designing a promising state-of-the-art way of achieving this aim. This technology is reported to open up new opportunities for applications in residential, professional lighting segments, as well as consumer electronics.

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NFC OpenSense technology from Thinfilm (photo: Thinfilm)

Thinfilm announces key partnership in NFC label conversion with Beneli

Thin Film Electronics ASA, a leading provider of NFC smart packaging solutions using printed electronics with headquarters in Oslo, Norway, announced a partnership with Sweden-based Beneli AB, a leader in self-adhesive labels and related solutions. The partnership is expected to significantly strengthen Thinfilm’s converter programme by providing strategic coverage in Scandinavia and in the broader European region.

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Victor Lee, CEO at Ascent Solar Technologies (photo: Ascent)

Ascent Solar clinches major contract for high-altitude aerospace application

Ascent Solar Technologies, Inc., a developer and manufacturer of lightweight and flexible thin-film photovoltaic solutions headquartered in Thornton, Colorado, announced that it has secured a major contract from an Asian customer to supply its high-voltage, superlight thin-film module for an advanced aerospace application.

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