The sensor solutions provider HENSOLDT (Taufkirchen, Germany) and Israel-based Nano Dimension, a leading additively manufactured electronics (AME) and printed electronics provider, have together achieved a major breakthrough on their way to utilising 3D printing in the development process of high-performance electronics components. Utilising a newly developed dielectric polymer ink and conductive ink from Nano Dimension, HENSOLDT succeeded in assembling the world-wide first 10-layer printed circuit board (PCB) which carries high-performance electronic structures soldered to both outer sides. Until now, 3D printed boards could not bear the soldering process necessary for two-sided population of components.
The display company Innolux (Hsinchu, Taiwan) and E Ink (Billerica, Massachusetts), a leading innovator of electronic ink technology, announced their collaboration on large-sized ACeP (Advanced Colour ePaper ) panels. Innolux is E Ink’s first partner to work on the production and sales of large-sized ACeP. With this partnership, both parties will focus on expanding electronic paper (ePaper) products in IoT and smart city applications.
Nano Dimensions Ltd., a leading additively manufactured electronics (AME) and printed electronics provider, and REHAU, a worldwide-leading polymer manufacturer, have succeeded in printing a 3D touch sensor. With the 3D electronic device, the premium polymer products from REHAU can be transformed into back-lit human-machine-interface surfaces. Thus, functionality and convenience are increased – all with a very sleek design. REHAU has established a dedicated technology platform called “Electronics into Polymers” with the mission to make their premium polymer products smarter and increase the value for its customers by seamlessly integrating electronics.
