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Avery Dennison’s atma.io joins CIRPASS to lay the ground for deployment of European digital product passports

Avery Dennison’s (Mentor, Ohio) atma.io connected product cloud joins the CIRPASS consortium, bringing together a core network of leading organisations in building the European vision for a unified Digital Product Passport (DPP) approach across multiple value chains. Funded by the European Commission under the Digital Europe Programme, CIRPASS aims to prepare the ground for the gradual piloting and deployment of the DPPs from 2023 onwards, with an initial focus on the electronics, batteries and textile sectors.

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TactoTek announces three product innovations at IMSE Days 4.0

The In-Mould Structural Electronics (IMSE) pioneer TactoTek (Oulu, Finland), recently announced three new products at its industry leader conference IMSE Days 4.0. The products are expected to enhance the company’s capability to address the growing demand for creating differentiating smart surfaces in the market place, manufactured in a sustainable manner. Karthikesh Raju, SVP for product management and marketing at TactoTek, says: “For our customers, the enhanced usability of TactoTek’s products and services will help scale the design, manufacturing and delivery of the solutions in the swiftly evolving market place.”

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Fraunhofer FEP: Modular AR service platform for industrial production

Within the project secureAR (funded by the Federal Ministry of Education and Research), a cross-industry and open cloud-based service platform with open industry interfaces is being developed. Within secureAR, the Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP (Dresden, Germany) is researching a novel hardware platform that is used in an innovative AR assistance system for the location- and situation-specific provision and visualisation of data in different industrial scenarios. This hardware platform will be presented at electronica 2022, from 15-18 November 2022, in Munich, Germany, at the Fraunhofer joint booth B4.258, in Hall B4.

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