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Fraunhofer IGCV: Smart finger ring with integrated RFID chip

House key, wallet, health insurance card, hotel key card — a smart finger ring could replace all these in the future. Produced by a 3D printing process, the ring has an integrated RFID chip, tamper-proof, sealed and invisible. The technology of integrating electronics during 3D printing can of course be used for other applications too. The multifunctional ring was developed by a research team at Fraunhofer Institute for Casting, Composite and Processing Technology IGCV.

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COLANDIS celebrates 25th anniversary

This May COLANDIS GmbH (Kahla, Germany) celebrates its 25th anniversary. On this occasion, the company would like to express its sincere thanks to all partners and friends who have been supportive within these 25 years.

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TechBlick’s May event: Printed, Hybrid, Structural and 3D Electronics, co-located with Quantum Dots: Material Innovations & Commercial Applications

TechBlick will host its third fully-virtual event on Tuesday, 11 and Wednesday, 12 May, starting at 2pm CEST. This time, the experts on emerging technologies have put together a world-class speaker programme focussing on two topics: “Printed, Hybrid, Structural and 3D Electronics” and “Quantum Dots: Material Innovations & Commercial Applications”.

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