DoMicro BV from The Netherlands has progressed in advanced packaging and integration of conventional electronics in flexible foil structures. Printing multi-layers, passive components and interconnection of thinned silicon dies is enabled by revolutionary developments in nano-printing and specific inkjet technology.
Over 2500 people will attend Printed Electronics Europe, part of the IDTechEx Show, which will be held on 10 & 11 April at the Estrel Convention Center in Berlin.