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Bayflex Solutions unveils first continuous testing lab in Europe at Holst Centre

Bayflex Solutions announced that it has signed a three-year agreement with Holst Centre to provide the latest generation of continuous testing solutions to accelerate development of the flexible electronics industries in Europe. Under the agreement Bayflex, the authorised representative of YUASA Systems in Europe, the Middle East and North America, will install several pieces of interchangeable YUASA endurance testing equipment at Holst Centre in Eindhoven, The Netherlands. The equipment will be used by both Holst Centre and its partners and by Bayflex Solutions.

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Fujifilm completes expansion of its facility in Mesa, Arizona, to supply the semiconductor industry

FUJIFILM Electronic Materials, U.S.A., Inc., a leading supplier of chemicals and advanced materials for the semiconductor industry with four manufacturing and R&D sites across the US, recently announced that it has completed its $88M expansion of its electronic materials facility in Mesa, Arizona. The added 80 000 sq. ft. to the existing facility includes five new buildings to expand Chemical Mechanical Polishing (CMP), high-purity solvents and process chemicals manufacturing capacity, warehousing, R&D and quality control laboratories, office space, and bulk chemical handling and storage.

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Imec and Buhler Leybold enable high-throughput manufacturing of filter-on-chip CMOS sensors with unmatched precision

Buhler Leybold Optics (Alzenau, Germany), a supplier of cutting-edge thin-film vacuum coaters and imec (Leuven, Belgium), a world-leading research and innovation center in nanoelectronics, have qualified Buhler’s HELIOS 800 tool to meet the stringent standards of the semiconductor industry and developed high performance filters for optical image sensors. The enhanced tool opens up many new applications that require a precise deposition of high-quality optical stacks at high manufacturing speed. The development is going to lead to a new generation of high-resolution low-cost hyperspectral imaging sensors.

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