TechBlick to host Innovations Festival covering printed, flexible, hybrid, 3D, wearable and textile electronics
On 22 June, TechBlick will once again be hosting its free to attend Virtual Innovations Festival covering printed, flexible, hybrid, 3D, wearable and textile electronics. Khasha Ghaffarzadeh, CEO of TechBlick, said: "We are confidentially predicting this Festival will be largest of its kind and a wonderful opportunity to hear the latest developments in PE and network with all the global players too." The audience will be truly global, with attendees from many different time zones.
This will be the second edition of TechBlick's Innovations Festival. It will take place over one day, 22 June, online. The agenda will be curated by the TechBlick team and covers all the key application and technology advancements in printed electronics.
Confirmed Speakers include: Fujikura Kasei, Siemens, Jabil, Henkel, Hahn Schickard, Suess MicroTec, Kodak, Arkema, Coatema, Sefar, Heraeus, Akoneer, Kimoto, Epshine, IDS, CondAlign and many more. In total over 50 companies will present on the day.
There will be many networking and engagement opportunities online from round-robin speed dating where you will randomly meet other participants for one-on-one video conversation to interactive hosted virtual booths.
According to TechBlick, this event will give attendees the buzz of on-site meetings making virtual interaction real. It will enable spontaneous discussions, serendipitous meetings and excellent networking. “We believe that in many ways it is more effective and fun than onsite in-person interactions and you can join for free!”
Caption: TechBlick’s Innovations Festival will take place on 22 June (photo: TechBlick)