TechBlick’s May event: Printed, Hybrid, Structural and 3D Electronics, co-located with Quantum Dots: Material Innovations & Commercial Applications
TechBlick will host its third fully-virtual event on Tuesday, 11 and Wednesday, 12 May, starting at 2pm CEST. This time, the experts on emerging technologies have put together a world-class speaker programme focussing on two topics: “Printed, Hybrid, Structural and 3D Electronics” and “Quantum Dots: Material Innovations & Commercial Applications”.
Speakers of the printed electronics track include representatives from companies and institutes such as IDENTIV, CPI, ARM, Coatema, SUNEW, Texas Instruments, NovaCentrix, VTT, PolyIC, Airbus, Boeing, and Panasonic. One of the highlights will be a panel discussion with Procter & Gamble and Coca Cola on “Smart & Intelligent Packaging”.
Speakers of the “Quantum Dots” track include representatives from companies and institutes such as Fraunhofer FEP, Helio Displays, Emberion, and the University of Cambridge.
The year-round virtual exhibition with numerous exhibitors from organic and printed electronics, as well as related fields, complements the high-calibre speaker line-up.
Please click on the following link to see the full agenda of the two-day event on 11/12 May: https://imgur.com/a/AMxbn8G
For a current blog post from TechBlick, click here: https://bit.ly/3b5TT8B
Caption: TechBlick’s May event offers two tracks focussing on printed and hybrid electronics, as well as quantum dots (photo: TechBlick)