TechBlick: March event with free-to-attend session


TechBlick has announced the largest online gathering of the printed, hybrid, in mould, 3D, R2R & textile electronics community. There will also be a special free-to-attend session at its tow-day online-only conference and exhibition taking place on 9 March 2022, 16:30 to 19:30 CET (10:30 to 13:30 ES).

Attendees will hear around 20 technology pitches, meet 40+ live exhibitors, and network with hundreds of attendees. They can join to network with peers, meet customers and partners, and learn the latest in TechBlick's engaging and buzzing ‘In-Person Virtual’ platform, which is designed to make virtual interaction real.

The LIVE exhibitors in the special session will include Coatema, Nagase, Kodak, Panasonic, Nano-Ops, CPI, Hamamatsu, Elantas, Seristampa, Quad Industries, Brilliant Matter, Sheldahl, Kimoto, Sateco AG, Fujikura Kasei, Metamaterials Inc, Fujifilm, Almax, ACI Materials, Laminar, General Graphene Corp, Fraunhofer IAP, Panacol, Keiron Printing Technologies, InnovationLab GmbH, Electroninks, Eastprint, Jet Metal, DuPont Teijin Films, Liquid Wire,  Sunray Scientific, Optomec, Epishine, Noctiluca, Sefar, Asada Mesh, Copprint, Holst Center, Neotech AMT GmbH, e2ip, XTPL, Brewer Science, Agfa, VTT, and Belink, MacDermid, others.

The free-to-access talks include

VTT: Taking the accuracy of printed electronics beyond 1µm

Kodak: High-speed ultrafine R2R printing for perovskite solar applications

Asada Mesh: Pushing the performance limit of screen printing to sub-30um range

Holst: Boosting the resolution and speed of the LIFT process

Coatema: Integrated turnkey R2R line with digital and analog printing

Copprint: Solderable copper paste

Neotech AMT GmbH: Scaling up 3D printed electronics

Applied Materials: MicroLEDs: printing fine interconnects and wrap-around electrodes

XTPL: Ultraprecise printed viscous silver inks for semiconductor packaging applications

Brewer Science: Deploying Printed Electronics for Water Quality Measurements

Agfa: Pushing the performance of silver nanoparticle inks for higher conductivity and lower curing temperature

Panasonic: A novel stretchable substrate with excellent forming and thermal properties

IDS: Leveraging aerosol to print finelines over 3D surfaces

Safi-Tech: Bringing performance of SAC solder to low temperature substrates

Sunray Scientific: Novel anisotropic conductive epoxies for fine-pitch high-density rapid-cure interconnects

Schreiner-Medipharm: Industrialization Of Smart Packages For Medication Adherence

STABILO International: Smart Pens: The Role of Printed Hybrid Electronics

Meta/Facebook: Panel Discussion and Q&A

Caption: TechBlick’s March event will take place on 9 March 2022 (photo: TechBlick)

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