TechBlick: March event with free-to-attend session
TechBlick has announced the largest online gathering of the printed, hybrid, in mould, 3D, R2R & textile electronics community. There will also be a special free-to-attend session at its tow-day online-only conference and exhibition taking place on 9 March 2022, 16:30 to 19:30 CET (10:30 to 13:30 ES).
Attendees will hear around 20 technology pitches, meet 40+ live exhibitors, and network with hundreds of attendees. They can join to network with peers, meet customers and partners, and learn the latest in TechBlick's engaging and buzzing ‘In-Person Virtual’ platform, which is designed to make virtual interaction real.
The LIVE exhibitors in the special session will include Coatema, Nagase, Kodak, Panasonic, Nano-Ops, CPI, Hamamatsu, Elantas, Seristampa, Quad Industries, Brilliant Matter, Sheldahl, Kimoto, Sateco AG, Fujikura Kasei, Metamaterials Inc, Fujifilm, Almax, ACI Materials, Laminar, General Graphene Corp, Fraunhofer IAP, Panacol, Keiron Printing Technologies, InnovationLab GmbH, Electroninks, Eastprint, Jet Metal, DuPont Teijin Films, Liquid Wire, Sunray Scientific, Optomec, Epishine, Noctiluca, Sefar, Asada Mesh, Copprint, Holst Center, Neotech AMT GmbH, e2ip, XTPL, Brewer Science, Agfa, VTT, and Belink, MacDermid, others.
The free-to-access talks include
VTT: Taking the accuracy of printed electronics beyond 1µm
Kodak: High-speed ultrafine R2R printing for perovskite solar applications
Asada Mesh: Pushing the performance limit of screen printing to sub-30um range
Holst: Boosting the resolution and speed of the LIFT process
Coatema: Integrated turnkey R2R line with digital and analog printing
Copprint: Solderable copper paste
Neotech AMT GmbH: Scaling up 3D printed electronics
Applied Materials: MicroLEDs: printing fine interconnects and wrap-around electrodes
XTPL: Ultraprecise printed viscous silver inks for semiconductor packaging applications
Brewer Science: Deploying Printed Electronics for Water Quality Measurements
Agfa: Pushing the performance of silver nanoparticle inks for higher conductivity and lower curing temperature
Panasonic: A novel stretchable substrate with excellent forming and thermal properties
IDS: Leveraging aerosol to print finelines over 3D surfaces
Safi-Tech: Bringing performance of SAC solder to low temperature substrates
Sunray Scientific: Novel anisotropic conductive epoxies for fine-pitch high-density rapid-cure interconnects
Schreiner-Medipharm: Industrialization Of Smart Packages For Medication Adherence
STABILO International: Smart Pens: The Role of Printed Hybrid Electronics
Meta/Facebook: Panel Discussion and Q&A
Caption: TechBlick’s March event will take place on 9 March 2022 (photo: TechBlick)