TechBlick: Innovation trends in the diverse area of printed, hybrid, in-mould and 3D electronics

 

In an article series, TechBlick (www.TechBlick.com) will highlight various innovation trends in the diverse area of printed, hybrid, in-mould, and 3D electronics. Their goal is to demonstrate progress and state-of-the-art on various fronts ranging from R2R on-paper printing to thin ICs to conductive inks to stretchable substrates to in-mould electronics and beyond.

They will showcase works from S&S, Enjet, CPI, Parsons, ARM, American Semiconductor, Agfa, Nanogate, and CEA-LETI. In the subsequent articles, TechBlick will cover developments at Signify, Jabil, Jones Healthcare Packaging, Swarovski, Wuerth, Ntrium, Sunew, XTPL, Identiv, Brilliant Matters, Philips 66, Alpha Assembly, GE Research, ACI, Panasonic, Safi-Tech, DuPont Teijin, VSParticle, Meta, NovaCentrix, Applied Materials, HP, Nano Ops, Brewer Science, e2ip, PolyIC, Kundisch, FIAT, Geely, and many others.

To continue reading this article please click https://www.techblick.com/post/innovation-trends-in-the-diverse-area-of-printed-hybrid-in-mold-3d-electronics

Caption: TechBlick sheds light on latest trends in printed, hybrid, in-mould and 3D electronics (photo: TechBlick)