TechBlick announces event on Digital and/or 3D Additive Manufacturing


TechBlick, a leading platform for emerging technologies, is hosting a live, virtual event on all the technology and applications aspects of digital and 3D additive manufacturing electronics.   The event takes place on 29 & 30 March on the platform.

It is a unique curated event covering the full spectrum of manufacturing technologies, frontier innovations, and existing and emerging applications from around the world. The event uniquely brings together material suppliers, technology developers, equipment manufacturers, and OEMs.

On the technology front, it will cover all the key technologies of the present and future including inkjet, microdispensing, direct wiring, direct plating, aerosol, jetting and spraying, aerosol, electrohydrodynamic printing, laser-induced forward transfer, etc. The technology will be covered for both flat 2D, 2.5, and even free-form 3D printing on complex 3D objects.

The agenda will cover printing of all manners of functional materials including conductive materials, ceramics, quantum dots, OLEDs, high--frequency insulators, PEDOT, organic semiconductors, solder resist, high viscosity pastes, and many more. On the application side, we seek to cover most key existing and emerging applications including photovoltaics, mmWave devices, OLEDs, QD-OLED, QLEDs, photodetectors and LEDs, quantum dots, antennas, functional 3D devices, circuits, PCBs, EMI shielding, semiconductor packaging, microLEDs, batteries, and beyond.

Khasha Ghaffarzadeh, CEO of TechBlick, said: “This conference focuses also on advancing the art, addressing long-standing technical limitations and pushing forward manufacturing technologies.” According to him, it is a must-attend event for those interested in the digital and 3D additive manufacturing of electronics.

Caption: On 29 and 30 March, TechBlick will host an event on Digital and/or 3D Additive manufacturing (photo: TechBlick)

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