TechBlick announces agenda for March event: Printed, Hybrid, InMold and 3D Electronics


TechBlick has published the agenda for its two-day conference and exhibition on Printed, Hybrid, InMold, and 3D Electronics. This event will take place LIVE (online) on 9-10 March 2022 in the interactive 'in-person virtual' space, making virtual interaction real and bringing together leading OEMs, manufacturers, material suppliers, and innovators.

Themes include: Printed, flexible, additive, hybrid, 3D, structural, R2R, in-mould, textile, stretchable, conformal and wearable electronics. The world-class speaker line-up brings together end users and OEMs, manufacturers, as well as innovative start-ups from around the world.

The agenda includes global organisations such as:  Meta/Facebook, Toppan, Swarovski, Asahi Kasei, Sunway Communications, Flex, Merck/Electroninks, Schreiner-Medipharm, STABILO, Clayens, Beko, Motherson Innovations, SiMolds, Sateco, IO Tech, Sun Chemical, Classic Stripes, KEMET, Arkema, Seriestampa, Elantis, Sefar, and more.

Furthermore, a LIVE exhibition will take place in parallel to the conference tracks, enabling attendees to meet the exhibitors live, network with other participants, and connect with OEMs and end users. This will be a truly global gathering, bringing the entire printed, hybrid, in-mould, and 3D electronics community together.

Exhibiting companies will include key players in the field including Kodak, Panasonic, NovaCentrix, Optomec, VTT, Nippon Kayaku, Quad Industries, Holst Centre, Agfa, Applied Materials, Asada Mesh, Brilliant Matters, DuPont, DuPont Teijin Films, Eastprint, CPI, Henkel, Hamamatsu, E2IP, Elantis, Sun Chemical, Seriestampa, Kimoto, IDS, NanoDimension, Keiron, Karl Mayer, IDS, Evonik, Copprint, and many others.

Caption: TechBlick’s event on 9-10 March 2022 will include a world-class speaker lineup (photo: TechBlick)

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