Rapidus and Fraunhofer IZM join forces for high-end performance packaging

Rapidus Corporation, Japan‘s high-end microelectronics manufacturer founded in 2022, and Fraunhofer IZM, a world-leading research institute for advanced microelectronic packaging, join forces for advanced packaging solutions for 2nm node high performance computing modules.

Rapidus is building a fab on the island of Hokkaido to manufacture 2nm node microchips and the related high-end performance package. METI, Japan‘s ministry of economy, trade and industry, approves Rapidus‘ plan for research and development of 2nm generation semiconductor integration technology for 2024. Thus, Fraunhofer IZM is happy to announce this corporation for one of the most important topics in the near future, realizing modules for e.g. 5G communications, autonomous driving or high performance computing.

Dr. Michael Schiffer, project leader at Fraunhofer IZM, says: "In March, we had a very inspiring meeting with Rapidus‘ president, Dr. Atsuyoshi Koike, in which he clearly emphasized the importance, not only to develop the most advanced node chip technology but also a highly advanced packaging technology to enable overall best-in-class performance. I‘m really looking forward to a fruitful cooperation with full commitment by everyone involved!"

Caption Picture 1: Dr. A Koike (President of Rapidus Corp., 3rd fr. right) and Prof. Dr. M. Schneider-Ramelow (Director of Fraunhofer IZM, 4th fr. right)

Caption Picture 2: High Performance Computing Module. (Adopted and translated from: https://www.meti.go.jp/policy/mono_info_service/joho/post5g/pdf/240402_theme_01.pdf)

High Performance Computing Module.

Pictures: Fraunhofer IZM



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