OE-A and EPSRC to host “Printed Electronics Insights: Smart Packaging & IoT“ event in Cambridge
Together with the EPSRC Centre for Innovative Manufacturing in Large-Area Electronics / University of Cambridge, the OE-A (Organic Electronics Association) is organising “Printed Electronics Insights: Smart Packaging & IoT” – a day of presentations and a panel-discussion, co-sponsored by FlexTech.
The event will be held on 12 October 2017 at Robinson College in Cambridge, UK, with company tours and a networking reception on the day before during the 41st OE-A working group meeting.
Inspired by a keynote on machine learning by Christopher Williams, chief architect for IBM Watson Europe, attendees will learn more on IoT and its application in smart packaging in presentations ranging from experiences of packaging companies to the latest innovations from academia.
The organisers have won Prof Richard Friend, FRS, FREng, as dinner speaker at the networking reception on 11 October. Furthermore, attendees can expect presentations by various renowned experts from international companies and research institutes such as PragmatIC, Crown Packaging, VTT and CDT. The finalised programme will be available soon.
Caption: Smart packaging & IoT will be the main topics of the OE-A and EPSCRC event in Cambridge on 12 October (photo: OE-A)