LOPEC 2020: 3D electronics - Fraunhofer IVV on the way to roll-to-roll production
At LOPEC, the trade fair for printed electronics in Munich, the Fraunhofer Institute for Process Engineering and Packaging IVV will be demonstrating how 3D electronics can be manufactured using the roll-to-roll principle from 25-26 March 2020 in Hall B0, Stand 411. This is made possible by a new thermoforming process. It enables higher degrees of forming through temperature profiling. It was developed at the Processing Technology Division in Dresden.
Thermoforming, which is suitable for high volumes, is combined with innovative temperature control technologies for precise control of the forming process. Until now, the production of electronic assemblies from structural and functional components required manufacturing, assembly and wiring. This results in a high time and monetary expenditure. In the forming technology developed within the framework of a joint project, a substrate is initially manufactured in a planar state using established technologies for printing and assembly. Only in the final processing step is the 3D geometry created by forming. Interactive (operating) surfaces can thus be produced cost-effectively. Application fields such as robotics, home, medical technology, automotive and aviation benefit from this. The high demands on ergonomics, design and functionality in these areas are thus optimally fulfilled. The new process also offers greater flexibility and design freedom.
The Fraunhofer IVV develops heating and moulding technologies in order to be able to realise novel products by means of innovative moulding processes and technologies. In product development with 3D electronic components, a team of experts in the institute's processing technology division provides support in design, material selection and process design. Using a specially developed characterisation method, process- and industry-related load limits can be determined. In addition, a thermoforming test stand enables flexible product manufacture. Various forming processes and technologies are available for this purpose. Using experimental and numerical simulation, the manufacturing process and product geometry can be simulated and optimised. With the thermoforming test stand the Fraunhofer IVV in Dresden is able to form different materials with applied electronics for companies in test runs.
Caption: Printed 3D electronic component (Photo: Fraunhofer IVV)