dpiX and TNO at Holst Centre sign MOU to formalise partnership
dpiX and TNO at Holst Centre recently announced the signing of a memorandum of understanding (MOU) to expand the two companies' collaboration in thin-film semiconductor and electronics research, development, prototyping and manufacturing. The partnership will enable growth for both organisations.
"We're poised to take full advantage of a major boost to the U.S. semiconductor industry that the CHIPS for America Act could make possible," said Frank Caris, CEO and president of dpiX. "With TNO at Holst Centre as a partner, we'll be able to expand even further."
dpiX holds the distinct advantage of running the largest A-Si semiconductor fabrication facility outside of Asia. TNO at Holst Centre brings with it an ecosystem of partnerships in industry and academia. Identifying interests and specific product needs in these areas will continue to create demand for dpiX's manufacturing output.
"This unique partnership combines TNO at Holst Centre's research and prototyping capabilities with the engineering and fabrication facilities of dpiX. Together, we will continue to advance our manufacturing and design expertise and capacity in flat-panel and assembly technologies," said Ton van Mol, CEO of TNO at Holst Centre. "We're also now looking into other applications such as LED displays and sensor systems."
The new MOU represents the formalisation of an ongoing partnership between dpiX and TNO at Holst Centre. The two have been working together for several years on the development of flexible medical detectors.
Caption: dpiX and TNO at Holst Centre have formalised their partnership (photo: TNO at Holst Centre)