AIXTRON acquires PlasmaSi
AIXTRON SE, a leading provider of deposition equipment to the semiconductor industry with headquarters in Herzogenrath, Germany, has announced that it has acquired Silicon Valley-based PlasmaSi, Inc. effective 1 April 2015. The American company enables the encapsulation of organic thin films by depositing ultra-thin and flexible barrier films through its proprietary technology, which is particularly well-suited for next-generation OLED display products including mobile phones, hand-held devices, tablets, wearables and large screen HDTV.
While initially designed and targeted for those applications, PlasmaSi’s technology can also be used to manufacture large area OLED lighting products as well as to address future opportunities in encapsulation markets. AIXTRON will integrate the company’s thin film encapsulation process into its existing OLED cluster for customer demonstration purposes.
“While increasingly expanding our business focus towards OLED in the coming years, we were looking to broaden our technology portfolio as well as to strengthen our customer access by adding PlasmaSi to our product portfolio,” comments Martin Goetzeler, president and CEO of AIXTRON SE. “Thin film encapsulation is an essential process step for OLED high volume manufacturing, specifically for flexible devices. In combining our OVPD technology with PlasmaSi’s innovative approach, we will be able to add significant value in the production of flexible OLED applications.”