Exhibitions / Events - News - OPE Journal - Organic & Printed Electronics

Dr Richard Price (left) and Scott White from PragmatIC (photo: PragmatIC)

PragmatIC to exhibit at IDTechEx Show Santa Clara 2019

Tuesday 19 November 2019
Exhibitions / Events

PragmatIC (Cambridge, UK) will be exhibiting and presenting at the IDTechEx Show in Santa Clara, USA, on 20-21 November. It has been an especially busy year for the company with the launch of its ConnectIC family of ultra-thin and low cost flexible integrated circuits (FlexICs) in February. This was followed by several key partner announcements, including Mühlbauer, Baoshen and Topolytics, and most recently Schreiner MediPharm.

Impressions from LOPEC 2019 (photo: Messe München)

Smart Living: Innovative solutions for everyday life at LOPEC 2020

Wednesday 06 November 2019
Exhibitions / Events

Fitness trackers, smart pharmaceutical packaging, adhesive solar films or steplessly dimmable windows: These are just a few examples of the applications that will be combined under the new focus topic Smart Living. LOPEC, the international exhibition and conference for the printed electronics industry, will thereby demonstrate the innovative opportunities that printed electronics offers to a wide variety of industries. The next LOPEC will take place from 24 to 26 March 2020.

Sun Chemical to demonstrate its wide range of solutions for industrial print at InPrint Munich 2019

Monday 04 November 2019
Exhibitions / Events

Sun Chemical (Parsippany, New Jersey) will exhibit its portfolio for functional, industrial and specialty print applications suitable for a broad range of market sectors at InPrint 2019, in Munich, Germany from 12 to 14 November on stand 246 in Hall A6.

Impressions from SEMICON Taiwan (photo: SEMI)

Brewer Science to share advanced packaging expertise at SEMICON Taiwan 2019

Tuesday 17 September 2019
Exhibitions / Events

Brewer Science, Inc. (Rolla, Missouri) announced its participation at SEMICON Taiwan, the country’s largest annual microelectronics event, to be held 18-20 September 2019, at TWTC Nangang Exhibition Center in Taipei. In addition to showcasing its offerings in Booth N0262, Brewer Science is presenting at and sponsoring the SiP Global Summit 2019, a key programme on advanced packaging being held in conjunction with the conference.

The Integrated Interior Platform is the basis for the human-machine interaction of the future: depending on the driving mode, it turns the cockpit into an information centre or a rolling living room with large displays (photo: Continental)

IAA 2019: Continental presents high-performance platform for the vehicle cockpit of tomorrow

Friday 13 September 2019
Exhibitions / Events

At the IAA 2019 in Frankfurt (12 to 22 September), Continental has unveiled the latest version of its Integrated Interior Platform (IIP). As a high-performance computer, this comprehensive solution for software and hardware provides the basis for interaction between humans and vehicles in the connected cockpit of tomorrow – and at the highest level of quality. In its cockpit demonstrator, the technology company showed how the IIP combines various displays, such as the instrument cluster and the centre console display, with Internet-based services to form a complete solution. The IIP is a milestone in the E/E architecture revolution, which is seeing in-car electronics move away from many individual control units to a few high-performance computers.