The BIOPV installation at the Heliatek headquarters in Dresden

Heliatek builds large BIOPV installation


Products

The Heliatek GmbH, a leading producer of organic solar films, has launched the largest building-integrated organic photovoltaic installation (BIOPV) of its kind. The films of the product line HeliaFilms were manufactured at the company’s headquarters in Dresden, Germany.

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A CNB touch-sensor by Canatu

Canatu partners with Display Solution to develop innovative touch display


Companies / Markets

Helsinki, Finland based Canatu Oy, a leading manufacturer of zero reflectance and flexible transparent conductive films and touch sensors, cooperates with Display Solution AG, a leading developer of customised industrial and digital signage solutions with headquarters in Gilching, Germany.

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DPP's technology for passive RFID antennas is now entering the market thanks to the cooperation with Mühlbauer

DP Patterning partners with Mühlbauer


Companies / Markets

DP Patterning AB (DPP), subsidiary of the Swedish non-profit electronic research institute Acreo, has signed a contract with the smart card, smart label and semiconductor producer Mühlbauer Group from Roding, Germany. The agreement gives Mühlbauer exclusive rights to exploit passive RFID antennas on the market. This unique manufacturing technology had been developed by Norrköping-based DPP.

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The research of Evonik and Holst Centre has now resulted in an introduction to mass production for the iXsenic technology

Evonik and Holst Centre introduce iXsenic technology into mass production


Products

Evonik Industries AG from Essen, Germany, a leading producer of specialty chemicals, and Holst Centre, an independent R&D centre for flexible electronics in Eindhoven, The Netherlands, have entered the next phase of their cooperation. Over the last two years, the partners have optimised the materials and processes of the new semiconductor technology iXsenic S. Now, the revolutionary technology has been introduced into mass production.

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A smart sunscreen bottle using printed electronics technology

Crown Packaging Design Challenge awards creativity in packaging design with printed electronics


Products

A recent industry-led design project by Brunel University London has produced a range of innovative packaging concepts with incorporated printed electronics elements. Crown Packaging, a leading manufacturer of metal packaging with headquarters in Philadelphia (PA), USA, has teamed up with The Centre for Process Innovation (CPI), a UK-based technology innovation centre, in order to set a challenge to 36 postgraduate design, innovation and branding students from Brunel University.

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