News - OPE Journal - Organic & Printed Electronics

Pressure sensor for breast cancer screening developed by the University of Tokyo

University of Tokyo develops flexible sensor for breast cancer screening

Wednesday 03 February 2016
Products

Healthcare practitioners may one day be able to physically screen for breast cancer using pressure-sensitive rubber gloves to detect tumours, owing to a transparent, bendable and sensitive pressure sensor newly developed by Japanese and American teams under the leadership of the University of Tokyo. Conventional pressure sensors are flexible enough to fit to soft surfaces such as human skin, but they cannot measure pressure changes accurately once they are twisted or wrinkled, making them unsuitable for use on complex and moving surfaces.

The Illumination concept of rlc's Lumen series

rlc packaging group shows new smart packaging concepts

Thursday 28 January 2016
Products

With the concept series “Lumen”, the folding carton manufacturer rlc packaging group, which is based in Hanover, Germany, presents new packaging ideas that connect lighting effects with special constructions. Printed electronics is used to underline the special forms and colours, as well as individual details of the packaging.

The flexible large-area fingerprint and vein sensor from FlexEnable and ISORG

FlexEnable and ISORG reveal first large-area fingerprint and vein sensor on plastic

Tuesday 26 January 2016
Products

FlexEnable, a leading developer of flexible organic electronics based in Cambridge, UK, and the French company ISORG, specialised in organic photodetectors and large-area image sensors, have presented the world’s first large-area flexible fingerprint sensor on plastic designed for biometric applications. With an 8.6 cm x 8.6 cm active area, 84µm pitch (78µm pixel size with 6µm spacing) and 1024 x 1024 = 1048576 pixel resolution, this flexible sensor is only 0.3 mm thick and can operate in visible and near infra-red up to wavelengths of 900nm.

Wim Christiaens of Quad Industries will present its company's fully integrated temperature logging label at AFIP 2016

AFIP 2016 announces programme details

Tuesday 19 January 2016
Exhibitions / Events

“Printing as an integral part of the production process” will be the main theme of the technical presentations during the third Advanced Functional and Industrial Printing (AFIP) conference, organised by the European Association for Printing Manufacturers in screen and digital printing (ESMA) on 2-3 March 2016 at the Radisson Blu Scandinavia Hotel in Düsseldorf, Germany.

CPI enhances printed electronics capability with photonic curing system from NovaCentrix

Friday 15 January 2016
Companies / Markets

The Centre for Process Innovation (CPI), a UK-based technology innovation centre, has recently partnered with the American-based equipment manufacturer NovaCentrix to install a specialist system designed for the high-speed photonic curing of printed electronics inks.